StratEdge Brings Gold Plated Tab and Packaging Expertise to CMSE 2026

POWAY, Calif.--(BUSINESS WIRE)--StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high-reliability packages, announces that it will exhibit at CMSE 2026, taking place April 28-30 in Los Angeles, CA. At Booth B10, StratEdge will highlight its gold plated tab product line for engineers developing high-frequency, high-power, and high-reliability devices.

“Our gold plated tabs support advanced die-on-tab assembly for GaN and other high-power devices, and we look forward to discussing packaging approaches that help customers balance thermal performance, manufacturability, and long-term reliability.”

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StratEdge’s gold plated tabs support eutectic die attachment of gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi). For chip-on-board applications, the chip is attached to the thermally conductive tab before the tab is installed onto the board, an approach especially well suited for organic boards that cannot withstand eutectic die attach temperatures. This helps ensure that the critical first level interface between chip and system is optimized for maximum device performance.

The company will also be available to discuss molded ceramic package options for RF and microwave applications up to 18 GHz. With more than 200 standard outlines available, StratEdge’s molded ceramic packages provide designers with a broad range of high-reliability options for defense, aerospace, and other harsh-environment applications.

“CMSE brings together engineers focused on performance and reliability in some of the industry’s most demanding environments,” said Casey Krawiec, VP of Sales at StratEdge. “Our gold plated tabs support advanced die-on-tab assembly for GaN and other high-power devices, and we look forward to discussing packaging approaches that help customers balance thermal performance, manufacturability, and long-term reliability.”

To learn more about StratEdge’s packaging and assembly capabilities, visit StratEdge at Booth B10 during CMSE 2026 or go to the StratEdge website. Visitors can also download the company’s white paper, Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems, at www.stratedge.com/white-paper-download-tab.html.

Photo: http://www.stratedge.com/cmse-tabs-molded-ceramic-parts.png

About StratEdge

StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. The StratEdge portfolio includes post-fired ceramic and lower-cost molded ceramic packages and die-on-tab (sub-mount) assembly services engineered for GaN, GaAs, and SiC devices in telecom/5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and harsh environments. Our facility in Poway, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.