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i3 Verticals Reports Third Quarter 2025 Financial Results
NASHVILLE, Tenn.--(BUSINESS WIRE)--i3 Verticals, Inc. (Nasdaq: IIIV) (“i3 Verticals” or the “Company”) today reported its financial results for the fiscal third quarter ended June 30, 2025. Highlights from continuing operations1 for the three and nine months ended June 30, 2025 vs. 2024 Third quarter revenue from continuing operations was $51.9 million, an increase of 12.4% over the prior year's third quarter. Revenue from continuing operations for the nine months ended June 30, 2025, was $158....
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Kopin Announces Appointment of Erich Manz as Chief Financial Officer
WESTBOROUGH, Mass.--(BUSINESS WIRE)--Kopin Corporation (NASDAQ: KOPN) a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, today announced the appointment of Erich Manz as Chief Financial Officer. Mr. Manz is an accomplished executive, bringing over three decades of financial and accounting experience in sensing, application-specific analog power and semiconductor technology ma...
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Universal Electronics Reports Financial Results for the Second Quarter 2025
SCOTTSDALE, Ariz.--(BUSINESS WIRE)--Universal Electronics Reports Financial Results for the Second Quarter 2025...
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Penguin Solutions Reports Inducement Grant Under Nasdaq Listing Rule 5635(c)(4)
MILPITAS, Calif.--(BUSINESS WIRE)--Penguin Solutions announced the grant of an inducement equity award to SVP of Strategy, Ted Gillick, in connection with his employment on Aug 4, 2025....
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Teledyne HiRel Semiconductors Launches eMMC 5.1 Module
MILPITAS, Calif.--(BUSINESS WIRE)--Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments. Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for embedded applications in aerospace, defense, industrial...
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Si2 Announces Creation of the Si2 LLM Benchmarking Coalition
AUSTIN, Texas--(BUSINESS WIRE)--Si2 announced creation of the LLM benchmarking coalition to expedite development of high-quality large language models for semiconductor design....
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Baya Systems Awarded Globally Recognized ISO 9001:2015 Certification for Quality Management by TÜV Rheinland
SAN JOSE, Calif. & COLOGNE, Germany--(BUSINESS WIRE)--Baya Systems, a leader in high-performance semiconductor system technologies, today confirmed it has achieved ISO 9001:2015 certification....
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Toyota Accelerates Production Innovation with Stratasys; Drives Efficiency, and Improves Lead Times with Additive Manufacturing
MINNETONKA, Minn. & REHOVOT, Israel--(BUSINESS WIRE)--Stratasys Ltd. (NASDAQ: SSYS), announced today that Toyota’s production engineering group is accelerating innovation on the factory floor through its strategic collaboration with Stratasys. The automaker is empowering automotive workers to seamlessly integrate advanced 3D printing technology in their manufacturing process, taking tools, fixtures and jigs from initial concept to working prototype in just one day. Through the more than 10-year...
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Quartz Imaging Launches PCI-AM Version 9 Featuring Groundbreaking Template Matching for Automated Semiconductor Metrology
VANCOUVER, British Columbia--(BUSINESS WIRE)--Quartz Imaging's latest PCI-AM Version 9 for Automated Microscopy Measurements is going to revolutionize the industry...
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Astronics Corporation Reports Record Aerospace Segment Sales in 2025 Second Quarter
EAST AURORA, N.Y.--(BUSINESS WIRE)--Astronics Corporation (Nasdaq: ATRO) Reports Record Aerospace Segment Sales in 2025 Second Quarter...