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NORTH FALMOUTH, Mass.--(BUSINESS WIRE)--Teledyne Marine, a global leader in maritime unmanned underwater vehicles and marine technologies, and M Subs, a UK-based innovator in marine unmanned systems and associated autonomy, are pleased to announce the signing of a Memorandum of Understanding (MOU) to establish a strategic collaboration. This partnership aims to leverage the complementary expertise of both organizations to develop and execute business opportunities related to the UK Royal Navy a...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Aeva® (Nasdaq: AEVA), a leader in next-generation sensing and perception systems, today announced its fourth quarter and full year 2025 results. Key Company Highlights A top European passenger OEM awarded Aeva a major production contract as the exclusive Tier-1 LiDAR supplier for the OEM’s global L3 production program outside of China with targeted SOP in 2028 New top 5 passenger OEM selected Aeva for a joint development program for its global vehicle lin...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Aeva® (Nasdaq: AEVA), a leader in next-generation sensing and perception systems, today announced that a top 5 global passenger OEM has selected Aeva for its vehicle development program. The program focuses on the recently introduced Aeva Atlas™ Ultra 4D LiDAR sensor for the OEM’s next-generation global production vehicle platform, and will further refine sensor configuration, integration and performance validation. The selection builds upon Aeva’s moment...

LAGUNA HILLS, Calif.--(BUSINESS WIRE)--BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, today announced its role as the official Technology Sponsor for the 2025-2026 Raytheon Autonomous Vehicle Competition (AVC). The Raytheon AVC, themed “Operation Touchdown,” challenges undergraduate engineering teams from across four United States-based regions—South, Puerto Rico, West Coast, and...

REDWOOD CITY, Kalifornien--(BUSINESS WIRE)--Helm.ai, ein führender Anbieter von fortschrittlicher KI-Software für autonomes Fahren und Roboterautomatisierung, hat heute eine bedeutende Funktionserweiterung von Helm.ai Driver bekannt gegeben: einen produktionsreifen, ausschließlich auf Bildverarbeitung basierenden Software-Stack, der nahtlos von fortschrittlichen Level-2+-Systemen bis hin zu Level-4-Autonomie im städtischen Raum skalierbar ist. Das System basiert auf der proprietären Factored Em...

NEW BRAUNFELS, Texas--(BUSINESS WIRE)--TaskUs, Inc. (Nasdaq: TASK) (“TaskUs” or the “Company”), a leading provider of outsourced digital services and next-generation customer experience to the world’s most innovative companies, today announced that it has secured commitments for a comprehensive refinancing to address its upcoming 2027 debt maturities and that its Board of Directors has authorized and declared a special cash dividend of $3.65 per share. The refinancing includes a $500 million te...

日本川崎--(BUSINESS WIRE)--(美国商业资讯)-- Toshiba Electronic Devices & Storage Corporation ("Toshiba")推出四款采用小型S‑VSON4T封装的电压驱动型光继电器：“TLP3407SRB”、“TLP3412SRB”、“TLP3412SRHB”和“TLP3412SRLB”。新款光继电器额定最高工作温度达135℃，可用于高温运行的设备。批量出货自即日起开始。 电气化和自动驾驶技术的进步如今要求车载设备中的电子元件采用高密度封装。这提高了车载半导体的工作温度，因此需要在相近条件下进行测试以评估可靠性；用于车载半导体的测试仪、老化测试设备、探针卡等装置，以及其中使用的光继电器，都必须能够在高温下工作。 Toshiba通过优化内置元件设计，将新产品的最高工作温度从现有产品[1]的125℃提升至135℃。此外，由于新产品为电压驱动型光继电器，输入端内置电阻，因此无需外接电阻，可节省电路板安装空间。产品还采用尺寸为1.45 × 2.0 mm（典型值）的S‑VSON4T小型封装。 这些因素的结合使新款光继电器适用...

日本川崎--(BUSINESS WIRE)--(美國商業資訊)-- Toshiba Electronic Devices & Storage Corporation ("Toshiba")推出四款採用小型S‑VSON4T封裝的電壓驅動型光繼電器：「TLP3407SRB」、「TLP3412SRB」、「TLP3412SRHB」和「TLP3412SRLB」。新款光繼電器額定最高工作溫度達135℃，可用於高溫運行的裝置。批量出貨自即日起開始。 電氣化和自動駕駛技術的進步如今要求車載裝置中的電子元件採用高密度封裝。這提高了車載半導體的工作溫度，因此需要在相近條件下進行測試以評估可靠性；用於車載半導體的測試儀、燒機測試裝置、探針卡等裝置，以及其中使用的光繼電器，都必須能夠在高溫下工作。 Toshiba透過內建元件設計的最佳化，將新產品的最高工作溫度從現有產品[1]的125℃提升至135℃。此外，由於新產品為電壓驅動型光繼電器，輸入端內建電阻，因此無需外接電阻，可節省電路板安裝空間。產品還採用尺寸為1.45 × 2.0 mm（典型值）的S‑VSON4T小型封裝。 這些因素的結合使新款光繼電器...

REDWOOD CITY, Calif.--(BUSINESS WIRE)--Helm.ai, a leading provider of advanced AI software for autonomous driving and robotics automation, today announced a major capability expansion of Helm.ai Driver: a production-ready, vision-only software stack designed to scale seamlessly from advanced Level 2+ systems through Level 4 urban autonomy. Built on Helm.ai’s proprietary Factored Embodied AI architecture, the system delivers seamless, human-like driving in complex city traffic without reliance o...

KAWASAKI, Japan--(BUSINESS WIRE)--Toshiba launches four small S‑VSON4T photorelays rated to 135°C, enabling high‑temperature operation in semiconductor test equipment....